3D X-ray Microscope (XRM)

XRM
XRM
  • Name: Xradia 520 Versa 3D X-ray Microscope
  • Manufacturer: Zeiss 
  • Model Number: Xradia 520 Versa
  • Location: AMMPI Annex 112
The ZEISS Xradia 520 Versa is a high-resolution, non-destructive 3D X-ray microscope (XRM) that enables sub-micron imaging (down to 700 nm resolution) of internal structures in materials, biological samples, and engineering components.
System Features

Resolution & Imaging Performance

  • Submicron 3D imaging with industry-best contrast: achieve 0.7 µm spatial resolution and minimum voxel size of 70 nm for high-fidelity, non-destructive analysis across science and industry.
  • Resolution at a Distance (RaaD) architecture: maintain fine resolution at larger working distances.

Advanced Optics & Detection

  • Two-stage magnification: geometric magnification onto a scintillator, followed by optical objective magnification for superior contrast and detail retention versus basic projection micro-CT.
  • Optional Flat Panel Extension (FPX): expand the detectable field and sample range, enabling efficient scans of larger parts while maintaining productive throughput.

Contrast Optimization & Material Discrimination

  • Dual Scan Contrast Visualizer (DSCoVer): leverage differences in effective atomic number and density to reveal features that are indistinguishable in a single scan; perform side-by-side tuning and collect data for dual-energy analysis with ease.
  • Automated Filter Changer (AFC): tune the X-ray spectrum for challenging samples or in situ workflows with 12 standard filters plus slots for custom filters; record filter choices in recipes for repeatable, automated runs.

Productivity & Throughput

  • High-Aspect Ratio Tomography (HART): intelligently vary projection spacing on flat samples to achieve up to 2X higher throughput or improved image quality.
  • Wide Field Mode (WFM): capture a ~2X wider lateral field of view and ~3X larger 3D volume versus standard mode, or use standard FOV to push resolution with more voxels in a single tomography.
  • Vertical Stitching + WFM: image specimens that are both wider and taller than the standard FOV

Application Flexibility

  • Versatile sample support for a wide range of sizes and materials—from semiconductor interconnects (e.g., defective TSVs) to composites, rocks/minerals, additively manufactured lattices, biomaterials, and more.
  • Non-destructive 3D imaging enables iterative inspection, correlation with other modalities, and longitudinal studies without damaging specimens.
Safety & Protection

Radiation Safety

  • Fully shielded X-ray enclosure designed to minimize stray radiation during operation.
  • Interlock-protected access doors: beam automatically disables if the enclosure is opened.
  • Emergency stop hardware for immediate system shutdown.
  • Status indicators (visual/audible) for beam-on state and system readiness.
  • Configurable exposure and energy limits within recipes to align with lab policies and sample sensitivity.

Operational Safeguards

  • Automated filter handling (AFC) to avoid manual exposure during spectrum changes and reduce handling errors.
  • Recipe-based automation that enforces validated scan parameters; embedded metadata records filter, energy, and exposure settings.
  • Collision avoidance and soft-limit travel boundaries for samples, stages, and detectors.
Configurability & Accessories

Imaging & Detection

  • Flat Panel Extension (FPX) (optional): expands field of view for larger samples while maintaining throughput.
  • Automated Filter Changer (AFC): 12 standard + 12 custom filter slots for tailored X‑ray spectra.
  • Objective & scintillator options: choose combinations optimized for resolution, contrast, or dose sensitivity.

Sample Handling & In Situ

  • In situ stages (thermal, mechanical, environmental, electrochemical) for real‑time studies under controlled conditions.
  • Specialized sample holders for wafers, PCBs, rocks/cores, fibers, pillars, biomaterials, and AM parts.
  • Calibration standards for geometry, resolution, and contrast verification.

Software & Workflow

  • DSCoVer dual‑energy workflows for material discrimination.
  • HART templates for high‑aspect‑ratio samples.
  • WFM & Vertical Stitching automation for large‑volume imaging.
  • Recipe management & batch queuing for repeatable, unattended scans.
  • Data export & integration with SEM/EDS, FIB‑SEM, and 3D analysis tools.

Facility & Integration

  • Vibration isolation platforms and environmental/acoustic enclosures for stable, quiet operation.
  • System indicators such as light towers and optional viewing windows.
  • Networking & power options for data routing and remote workflows.

Service & Lifecycle

  • Preventive maintenance programs and source life management.
  • Applications training for DSCoVer, HART, WFM, and advanced contrast techniques.

Zeiss Specifications